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Published by by Manuela Markiewitz

System design and housing solutions at Embedded World 2023

The selection of components for a hardware application can no longer be made solely on the basis of individual technical parameters. For the realization of an innovative product application, a view of the overall system is crucial. In Hall 3, Booth 554, POLYRACK will be demonstrating from March 14 to 16, 2023, how customers can optimize the time to market of their individualized products, among other things, through the housing solutions of the EmbedTEC and FrameTEC series

FrameTEC: Scalable, EMC-tight - Now also with display solution
The self-supporting, high-strength carrier frame housing for desktop cases and 19" racks enables a high degree of design flexibility for industrial applications. The further development of the series now also offers the option of integrating displays to make the HMI even more intuitive and effective.
EmbedTEC: Variable basis for diverse developments
In addition to embedded computing and HMI applications, the EmbedTEC housing series is also suitable for applications where SFF (Small Form Factor) or eNUC (embedded Next Unit of Computing) are the focus.
System design: Thinking ahead from the board level
POLYRACK's consistently holistic approach to product realization is based on experience and in-depth electronic expertise, e.g. in the development of standards-based backplanes such as CompactPCI, VME64x and VPX. In addition, the company has powerful tools, such as Altium Designer as well as SolidWorks, to realize even extremely complex and demanding developments.
"At embedded world 2023, we will give visitors at our booth an insight into our expertise and show that our understanding of the system concept goes far beyond housing technology," said Maximilian Schober, Head of Sales Germany & Marketing at POLYRACH TECH-GROUP. "This allows us to offer significant added value for our customers, resulting in a shortened time to market and optimized TCO."



The POLYRACK TECH-GROUP develops and manufactures high quality system solutions for electronics. Thanks to a broad range of technologies in the mechanical manufacturing, systems engineering / electronics, plastics and surface finishing, POLYRACK offers electronic packaging for every need. The service offering extends from consulting in the conception phase, development, manufacturing and assembly right through to logistic solutions and sourcing services.

The group of companies comprises POLYRACK Electronic-Aufbausysteme GmbH, RAPP Kunststofftechnik GmbH, POLYRACK Aerospace GmbH, Metalle in Form Geräteteile GmbH as well as subsidiaries in America, Belgium, China and Switzerland. The owner-managed company has around 500 employees worldwide and achieved a turnover of 86.1 million euros in the group in fiscal year 2022.

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