Rutronik: partnership with VIA

Rutronik Elektronische Bauelemente GmbH, one of the leading broadline distributors of electronic components, and VIA Technologies, Inc., a global leader in the design and development of intelligent automotive, industrial, building, and edge solutions, expand their partnership for the European Market. VIA is an expert in high-performance Edge IoT platforms for future technologies and applications such as Edge Computing, Industrial IoT, Smart Home, and Future Mobility.

Headquartered in Taipei, Taiwan, VIA Technologies, Inc. is specialized on edge computing solutions. VIA connects businesses to advanced AI, IoT, and computer vision technologies with intelligent automotive, edge, industrial, and building solutions that transform operational safety and efficiency. VIA's global network links the high-tech hubs in the USA, Asia, and Europe. The company's customer base includes many of the world's leading high-tech, manufacturing, and transportation companies.

"VIA’s intelligent edge solutions provide a broad selection of highly-integrated modules, boards, starter kits, and systems that accelerate time-to-market for innovative industrial, retail, and commercial Edge AI devices," said Anja Schaal, Senior Manager Product Marketing Boards & Storage at Rutronik. "Partnering with VIA opens up the opportunity to offer our customers all of Mediatek's design-level solutions – from chip-level design to modules and even full highly integrated system designs. We are excited to have VIA's cutting-edge solutions in our portfolio, enabling our current and future customers to unlock the power of edge computing."

"We enable enterprises to transform the efficiency, and sustainability of their operations by combining advanced Edge AI, computer vision, and cloud technologies with powerful and reliable systems and devices," said Epan Wu, General Manager at VIA Intelligent Solutions. "With Rutronik, we have a very experienced distribution partner with roots in Europe and a global network. The deep understanding of design-in processes but also insights along the entire product life cycle is an extremely valuable quality that will help us to expand our customer base in Europe and beyond."

VIA's intelligent edge modules and boards are available in a choice of SOM, Mini-ITX, and Pico-ITX form factors. Built to the highest quality standards, they have guaranteed longevity to support extended product lifecycles. Android and Linux board support packages and software evaluation kits are included to simplify system development for Arm-based platforms. Flexible hardware and software customization services are also available to accelerate time-to-market and minimize development costs.