+49 8122 559170

Molex signs Rutronik for UK and Ireland

Agentur Lorenzoni News Aktueller Artikel

Veröffentlicht

Interconnection, antennas and RF solutions for IoT solutions

Rutronik has been appointed by Molex to distribute its complete product range in the UK and Ireland. The move enables Rutronik to extend its offering with one of the foremost interconnection portfolios and also with antennas and RF solutions that increasingly play a part in the delivery of advanced IoT solutions.

A major factor in Molex’s decision was Rutronik’s strong design and field application engineering capabilities.

Rutronik has blazed a trail, supporting established and emerging companies in bringing their designs to market. The addition of Molex’s comprehensive range of connectivity and related products is complementary to the existing Rutronik line card and will provide customers with access to even more focused design and purchasing support.

Commenting on the agreement, Darren Fairs, UK Distribution Manager at Molex said:

“We have been extremely impressed with Rutronik’s technical and sales teams in the UK and Ireland. Their market knowledge and contacts extend across the established landscape and into many new and exciting companies who can benefit from the Molex product line. In addition, Rutronik’s technical team is well qualified to support customers through the design and development process.” 

Markus Krieg, Managing Director Marketing at Rutronik added:

“Molex is a major global player and its range complements our existing portfolio in UK perfectly. As we work with more companies to help them bring their IoT products to market, the ability to add further wired and wireless interconnection solutions to our existing technology offerings will prove invaluable."

Rutronik has the Molex franchise in UK and Ireland starting 1st April 2018. This will build on the existing strong relationship between the companies elsewhere in Europe.

 

Über Rutronik Elektronische Bauelemente GmbH

Rutronik Electronics Worldwide Logo

Rutronik Elektronische Bauelemente GmbH is the third largest distributor in Europe (European Distribution Report 2016) and the number ten worldwide (SourceToday, May 2017). The broadline distributor supplies semiconductors, passive and electromechanical components as well as boards, storage, displays & wireless products. The company's primary target markets are the automotive, medical, industrial, home appliance, energy and lighting industries. The ranges RUTRONIK EMBEDDED, RUTRONIK SMART, RUTRONIK POWER and RUTRONIK AUTOMOTIVE provide customers with specific products and services in groups tailored to the respective applications. Expert technical support for product development and design-in, individual logistics and supply chain management solutions as well as comprehensive services complete its scope of performance.

The company, founded by Helmut Rudel in 1973 in Ispringen, Germany, now has over 70 subsidiaries in Europe, Asia and the Americas. Rutronik employs more than 1,600 staff worldwide and achieved Group sales of 950 million euros in the fiscal year 2017.

Zurück

Über uns

Klarheit, Kooperation und Können – das sind unsere Zutaten für Kompetenz: Klare und ehrliche Kommunikation, kooperative und partnerschaftliche Zusammenarbeit sowie ein kreatives und umsetzungsstarkes Team, das Dinge mit der Kundenbrille betrachtet. Genau das wissen unsere langjährigen Kunden zu schätzen.

Kontaktdaten

Agentur Lorenzoni GmbH
Landshuter Straße 29
85435 Erding
Deutschland
 
Tel.: +49 8122 55917-0
Fax: +49 8122 55917-29
 
eMail: pr@lorenzoni.de

aktuellster Artikel

Schukat auf der PCIM 2024: Halle 9, Stand 9-626

Schukat, Distributor für elektronische Bauteile und Taiwan Semiconductor (TSC) blicken in diesem Jahr auf eine sehr erfolgreiche, 20-jährige Partnerschaft zurück. Im Zuge dieser Zusammenarbeit stellen die beiden Unternehmen gemeinsam vom 11. bis 13. Juni 2024 auf der international führenden Fachmesse und Fachkonferenz für Leistungselektronik aus. Der Fokus der diesjährigen PCIM liegt im Bereich neue Materialien für zukünftige Modultechnologie und „Power Embedding“. Schukat präsentiert dem Fachpublikum unter anderem TSCs erste Wide-Bandgap SiC 650 V Schottky- Diode für eine noch bessere Effizienz in Hochleistungssystemen.

Weiterlesen …